8 February 2021

JIACO Instruments joins iRel40

JIACO Instruments is now a part of European research project which aims to improve the reliability of electronic components for future applications The Europe-wide research initiative […]
1 February 2021

EDFA Magazine article on atmospheric oxygen-only plasma for decapsulation

Our article “Enabling True Root Cause Failure Analysis Using an Atmospheric Oxygen-Only Plasma for Decapsulation of Advanced Packages” is now available in digital edition of EDFA […]
29 September 2020

JIACO Instruments at iMAPS 2020 virtual exhibit hall – October 5-8

See our machine, discuss potential decapsulation solutions via the live chat function! Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements […]
27 February 2020
IMAPS International Conference on Device Packaging

JIACO Instruments at IMAPS 16th International Conference and Exhibition on Device Packaging 2020, March 2-5, Nov 11 to 14, Fountain Hills, Arizona USA

JIACO Instruments at IMAPS 16th International Conference and Exhibition on Device Packaging 2020 Booth 13: See our machine, discuss potential Contact us at info@jiaco-instruments.com if you […]
3 February 2020
Chip Targets Business Manager, Peter Nguyen, signs the contract with JIACO Instruments CEO, Rene van Eijkelenburg, at the ISTFA 2019

Chip Targets becomes the first Failure Analysis Service Lab in the US to offer atmospheric Microwave Induced Plasma (MIP) decapsulation services

Chip Targets joins MASER Engineering (The Netherlands) & Hirex Engineering (France) in offering MIP decapsulation services. Delft, the Netherlands, February 3rd, 2020 Chip Targets is pleased […]
19 January 2020
ISTFA 2019 – Silver Wire Ball Bond and Stitch Bond - MIP Decapsulation – JIACO Instruments

JIACO Instruments presents patent-pending Ag silver wire plasma decapsulation process at ISTFA 2019

Together with our customer Hirex Engineering during ISTFA 2019, Dr. Jiaqi Tang presented JIACO Instruments patent-pending Ag silver wire plasma decapsulation process. The paper entitled ‘Artifact-Free Decapsulation of […]
11 November 2019
MIP User Group meeting image 2019 - Jiaqi User feedback

MIP User Group Meeting at ISTFA 2019 by JIACO Instruments.

JIACO Instruments held the inaugural MIP user group meeting. On November 10th, JIACO Instruments held the inaugural MIP user group meeting before the official ISTFA 2019 […]
14 October 2019

JIACO Instruments at ISTFA conference 2019, Nov 11 to 14, Portland

Visit JIACO Instruments to discuss damage free decapsulation Booth 315: See our machine, discuss potential Session: Sample Preparation and Device Deprocessing (Nov 14, Thursday): Presenting our […]
11 September 2019

JIACO Instruments joins European project focusing on power semiconductor devices

JIACO Instruments joins European project focusing on power semiconductor devices The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight […]