Breakthrough Innovation in IC package decapsulation
JIACO Instruments MIP decapsulation system is a breakthrough innovation:Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilizing only Oxygen and patented Hydrogen-based recipes. Request information
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Breakthrough Innovation in IC package decapsulation
JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilizing only Oxygen and patented Hydrogen-based recipes. The system has been proven for Cu, PCC, Ag, Au bond wires, and for advanced package types like 3D, SiP WLCSP, BOAC, all without process-induced damage for reliability test and failure analysis.
