About us
JIACO Instruments' MIP decapsulation system is a breakthrough innovation:
Automated atmospheric pressure Microwave-Induced Plasma (MIP) decapsulation utilizing only Oxygen and patented Hydrogen-based recipes.
Application Range:
I. Wire Bond:
II. Flipchip:
- RDL
- Cu Pillar, Solder Bump
- Fan-in and Fan-out WLP
V. Failure Type:

Dr. Jiaqi Tang
Dr. Jiaqi Tang received B.S. in materials science from Fudan University in 2007 and M.Sc. in materials science from University of Pennsylvania in 2009, where he was involved in research projects related to semiconductor devices.
From 2009 to 2014 he has been working towards his Ph.D. degree at Delft Institute of Microsystems and Nanoelectronics (DIMES), Delft University of Technology. His research activities focus on developing a Microwave Induced Plasma (MIP) instrument for copper wire bonded semiconductor package decapsulation application. During this period, intensive contacts were established with the semiconductor industry. The groundbreaking research jointly developed with industrial partners on the MIP technology has been presented at ECTC, ISTFA, EPTC, ICEPT conferences.
Since 2014, Jiaqi became the President and CTO of JIACO Instruments, the start-up company he co-founded to commercialize the MIP machine.
