Decapsulation Technology
The JIACO Instruments Microwave Induced Plasma (MIP) decapsulation system allows one to access the area of interest during failure analysis protocol easily and facilitates the determination of the cause of the failure. Its benefits include rapid sample preparation without the introduction of artifacts, which may contribute uncertainty to the fault detection process. This MIP system, in turn, allows the engineer to reach a conclusion as to the actual root cause of the problem, and to define a permanent fix to remove the issue for the future. This MIP plasma system is also invaluable during qualification procedures for new processes and materials.
Comparison between MIP and Acid:

Comparison between MIP and conventional plasma:


Application Range:
I. Wire Bond:
II. Flipchip:
- RDL
- Cu Pillar, Solder Bump
- Fan-in and Fan-out WLP
V. Failure Type:
Our Microwave Induced Plasma (MIP) Systems

MIP | IC Decap
Automated atmospheric pressure MIP IC decapsulation utilizing only Oxygen and patented Hydrogen-based recipes. MIP is the global standard for tackling the semiconductor industry’s most demanding decapsulation challenges.
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MIP+ | Die-level Etching
The Next Generation in Semiconductor Decapsulation and Etching. MIP+ extends MIP’s proven capabilities from package-level to die-level etching.
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