Decapsulation Technology
Market trends affecting decapsulation:
- Shift from Au to other bond wires and increasing complexity of packaging
- 0 ppm drive within the industry
Source: Heraeus Materials
The JIACO Instruments MIP decapsulation system allows one to access the area of interest during failure analysis protocol easily and facilitates the determination of the cause of the failure. Its benefits include rapid sample preparation without the introduction of artifacts, which may contribute uncertainty to the fault detection process. This MIP system, in turn, allows the engineer to reach a conclusion as to the actual root cause of the problem, and to define a permanent fix to remove the issue for the future. This MIP plasma system is also invaluable during qualification procedures for new processes and materials.
Comparison between MIP and Acid:
Comparison between MIP and conventional plasma:
Application Range:
I. Wire Bond:
II. Flipchip:
- RDL
- Cu Pillar, Solder Bump
- Fan-in and Fan-out WLP