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Applications & Publications
Home
Applications & Publications
Applications & Publications
Browse by Application:
I. Wire Bond:
Ag Wire (patented)
Cu, PCC, Au, Al Wire
Fresh & Thermally Stressed
II. Flipchip:
RDL
Cu Pillar, Solder Bump
Fan-in and Fan-out WLP
III. Chip:
BOAC
GaAs, GaN
SAW, BAW
IV. Package:
2.5D
3D
Module
SiP
, CoWoS
V. Failure Type:
EOS
Migration
Corrosion
Contamination
VI. Encapsulant:
High Tg
Glob Top
Underfill, DAF, FOW
Clear Mold,
PI/PBO Die Coat
Browse by Publication:
Microelectronics Reliability (Volume 137, October 2022, 114766)
Aluminium Corrosion in Power Semiconductor Devices
EDFA Magazine 2021 (Volume 23, Issue 1)
Enabling True Root Cause Failure Analysis Using an Atmospheric Oxygen-Only Plasma for Decapsulation of Advanced Packages
ISTFA 2020 (EDFAS Virtual Workshop 2020)
Benefits of using a CF4-Free Microwave Induced Plasma (MIP) Spot Etch Process to Remove Underfill and Analyze 2.5D Modules
ISTFA 2019 (featuring patented Ag wire plasma decapsulation process)
Artifact-Free Decapsulation of Silver Wire Bonded Semiconductor Devices Using Microwave Induced Plasma
ISTFA 2018
Preserving Evidence for Root Cause Investigations with Halogen-Free Microwave Induced Plasma Decapsulation
ISTFA 2017
Halogen-free Microwave Induced Plasma Decapsulation of System in Package Modules
ISTFA 2016
CF4-free Microwave Induced Plasma Decapsulation of Automotive Semiconductor Devices
ISTFA 2015
Decapsulation of Multi-Chip BOAC Devices with Exposed Copper Metallization Using Atmospheric Pressure Microwave Induced Plasma
IPFA 2017
Unique Failure Analysis Capabilities Enabled by the MIP Decapsulation Technique
IPFA 2016
Decapsulation of copper wire devices with high Tg mold compound using microwave induced plasma
ECTC 2015
Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation
ECTC 2013
Microwave Induced Plasma Decapsulation of Stressed and Delaminated High Pin-count Copper Wire Bonded IC Packages
ECTC 2012
Flexible system for real-time plasma decapsulation of copper wire bonded IC packages
EPTC 2012
Decapsulation of High Pin Count IC Packages with Palladium Coated Copper Wire Bonds Using an Atmospheric Pressure Plasma
ICEPT 2013
Microwave Induced Plasma Decapsulation of Thermally Stressed Multi-tier Copper Wire Bonded IC Packages
ICEPT 2012
Process Control in Plasma Decapsulation: Preventing Damage to the Copper Wire Bonds & Controlled Removal of Si3N4 Passivation Layer
ICEPT 2011
Plasma Decapsulation of Plastic IC Packages with Copper Wire Bonds for Failure Analysis
ICEPT 2010
Optimization of the Microwave Induced Plasma System for Failure Analysis in Integrated Circuit Packaging
JSS 2012
Fast Etching of Molding Compound by an Ar/O2/CF4 Plasma and Process Improvements for Semiconductor Package Decapsulation
proc. ECS 2011
Plasma etching for failure analysis of integrated circuit packages
Seeing is Believing
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