Applications & Publications
Browse by Publication:
Microelectronics Reliability (Volume 137, October 2022, 114766)
EDFA Magazine 2021 (Volume 23, Issue 1)
ISTFA 2020 (EDFAS Virtual Workshop 2020)
ISTFA 2019 (featuring patented Ag wire plasma decapsulation process)
Our Microwave Induced Plasma (MIP) Systems

MIP | IC Decap
Automated atmospheric pressure MIP IC decapsulation utilizing only Oxygen and patented Hydrogen-based recipes. MIP is the global standard for tackling the semiconductor industry’s most demanding decapsulation challenges.
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MIP+ | Die-level Etching
The Next Generation in Semiconductor Decapsulation and Etching. MIP+ extends MIP’s proven capabilities from package-level to die-level etching.
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