Applications & Publications

Applications & Publications

MIP IC Decap ApplicationsMIP Applications

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Microelectronics Reliability (Volume 137, October 2022, 114766)

ISTFA 2019 (featuring patented Ag wire plasma decapsulation process)

Our Microwave Induced Plasma (MIP) Systems

MIP | IC Decap

Automated atmospheric pressure MIP IC decapsulation utilizing only Oxygen and patented Hydrogen-based recipes. MIP is the global standard for tackling the semiconductor industry’s most demanding decapsulation challenges.
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MIP+ | Die-level Etching

The Next Generation in Semiconductor Decapsulation and Etching. MIP+ extends MIP’s proven capabilities from package-level to die-level etching.
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Seeing is Believing

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