Applications & Publications

Browse by Application:

Browse by Publication:

EDFA Magazine 2021 (Volume 23, Issue 1)

• Enabling True Root Cause Failure Analysis Using an Atmospheric Oxygen-Only Plasma for Decapsulation of Advanced Packages

ISTFA 2020 (EDFAS Virtual Workshop 2020)

• Benefits of using a CF4-Free Microwave Induced Plasma (MIP) Spot Etch Process to Remove Underfill and Analyze 2.5D Modules

ISTFA 2019 (featuring patent pending Ag wire plasma decapsulation process)

• Artifact-Free Decapsulation of Silver Wire Bonded Semiconductor Devices Using Microwave Induced Plasma

ISTFA 2018

• Preserving Evidence for Root Cause Investigations with Halogen-Free Microwave Induced Plasma Decapsulation

ISTFA 2017

• Halogen-free Microwave Induced Plasma Decapsulation of System in Package Modules

ISTFA 2016

• CF4-free Microwave Induced Plasma Decapsulation of Automotive Semiconductor Devices

ISTFA 2015

• Decapsulation of Multi-Chip BOAC Devices with Exposed Copper Metallization Using Atmospheric Pressure Microwave Induced Plasma

IPFA 2017

• Unique Failure Analysis Capabilities Enabled by the MIP Decapsulation Technique

IPFA 2016

• Decapsulation of copper wire devices with high Tg mold compound using microwave induced plasma

ECTC 2015

• Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation

ECTC 2013

• Microwave Induced Plasma Decapsulation of Stressed and Delaminated High Pin-count Copper Wire Bonded IC Packages

ECTC 2012

• Flexible system for real-time plasma decapsulation of copper wire bonded IC packages

EPTC 2012

• Decapsulation of High Pin Count IC Packages with Palladium Coated Copper Wire Bonds Using an Atmospheric Pressure Plasma

ICEPT 2013

• Microwave Induced Plasma Decapsulation of Thermally Stressed Multi-tier Copper Wire Bonded IC Packages

ICEPT 2012

• Process Control in Plasma Decapsulation: Preventing Damage to the Copper Wire Bonds & Controlled Removal of Si3N4 Passivation Layer

ICEPT 2011

• Plasma Decapsulation of Plastic IC Packages with Copper Wire Bonds for Failure Analysis

ICEPT 2010

• Optimization of the Microwave Induced Plasma System for Failure Analysis in Integrated Circuit Packaging

JSS 2012

• Fast Etching of Molding Compound by an Ar/O2/CF4 Plasma and Process Improvements for Semiconductor Package Decapsulation

proc. ECS 2011

• Plasma etching for failure analysis of integrated circuit packages