Breakthrough Innovation in IC package decapsulation

JIACO Instruments MIP decapsulation system is a breakthrough innovation:
Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes. Request information



Breakthrough Innovation in IC package decapsulation

JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for advanced package types like 3D, SiP, WLCSP, high Tg, Chip on Board, BOAC; all without process induced damage for reliable failure analysis and reliability testing.







Seeing is Believing

Contact us to test your samples with MIP

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