Breakthrough Innovation in IC package decapsulation

JIACO Instruments MIP decapsulation system is a breakthrough innovation:
Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilizing only Oxygen and patent-pending Hydrogen-based recipes. Request information



Breakthrough Innovation in IC package decapsulation

JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilizing only Oxygen and patent-pending Hydrogen-based recipes. The system has been proven for Cu, PCC, Ag, Au bond wires, and for advanced package types like 3D, SiP WLCSP, BOAC, all without process-induced damage for reliability test and failure analysis.







Seeing is Believing

Contact us to test your samples with MIP

Request information