Join JIACO Instruments, a Gold Sponsor, at the 2023
PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE) Conference in Huntsville, AL from October 24-26

• Visit JIACO Instruments at PAINE conference 2023 to discuss how atmospheric O2-only decapsulation enables the further physical inspection of your devices without process induced damage (e.g. corroded/missing bond wires, damage dies etc.) or any electrical damage, retaining the key information on the chips, to ensure your devices data is still readable/accessible for your further analysis;
• We would be glad to discuss our extensive MIP applications range across the latest packaging types with you at PAINE 2023