JIACO Instruments at ESREF + AEC (2nd to 5th of October 2023) in Toulouse, France
19 September 2023JIACO Instruments at ISTFA conference 2023, Nov 12 – Nov 16, Phoenix, Arizona, Booth #507
31 October 2023
Join JIACO Instruments, a Gold Sponsor, at the 2023
PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE) Conference in Huntsville, AL from October 24-26
- Visit JIACO Instruments at PAINE conference 2023 to discuss how atmospheric O2-only decapsulation enables the further physical inspection of your devices without process induced damage (e.g. corroded/missing bond wires, damage dies etc.) or any electrical damage, retaining the key information on the chips, to ensure your devices data is still readable/accessible for your further analysis;
- We would be glad to discuss our extensive MIP applications range across the latest packaging types with you at PAINE 2023