Visit JIACO Instruments at booth B1 in the exhibition hall

Join JIACO Instruments at the 31st edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2024), co-located with the International ESD Workshop (IEW-Asia 2024), set against the stunning backdrop of Marina Bay Sands Convention Center in the heart of Singapore!

IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device/circuit/module failure that serves as a critical input for future design for reliability.

JIACO Instruments artifact-free Microwave Induced Plasma (MIP) decapsulation technology will be presented during the Technology Showcase on Monday, July 15th. Hear about our latest applications and developments and be into win some spot prizes!

JIACO Instruments will also participate in the exhibition, make sure to stop by booth B1 during the exhibition periods. Our team will be glad to introduce our artifact-free Microwave Induced Plasma (MIP) decapsulation technology and advise on how its application range can meet your requirements in physical failure analysis.

Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after IPFA).

Registration for IPFA is via the IPFA website.