Hear JIACO Instruments latest research on Improving the Wire Pull Test& Failure Analysis for Copper Wired Components, 2PM Wednesday April 24th

The Automotive Electronics Council (AEC) was originally established by Chrysler, Ford, and GM for the purpose of establishing common part-qualification and quality-system standards. The Twenty-Second Annual Automotive Electronics Reliability Workshop will be held April 23-25, 2024 at the Sheraton Detroit Novi Hotel located in Novi, Michigan, USA. Further details including registration can be found on the AEC website: http://www.aecouncil.com/AECWorkshop.html

Jiaqi Tang, CTO of JIACO Instruments will present a comprehensive study of using Microwave Induced Plasma (MIP) decapsulation in AEC Q006 qualification. It will be demonstrated that using MIP in qualification has strong advantages over acid decapsulation such as high Cpk value in wire bond pull test, clean die surface, and artifact-free decapsulation that enables efficient root cause failure analysis. Finally, recommendations will be given for the use of MIP decapsulation for AEC Q006 qualification.

Contact us at info@jiaco-instruments.com if you would like to know more about our MIP decapsulation system beforehand, and/or would like to meet with us separately (before, during or after the AEC Workshop).