JIACO Instruments at ISTFA conference 2022, Oct 30 – Nov 3, Pasadena, California
6 October 2022
MIP decapsulation included in JEDEC standard on wire bond pull test methods
21 February 2023
Visit JIACO Instruments to discuss artifact-free MIP decapsulation
This year, for the first time, JIACO will be exhibiting at Defense Manufacturing Conference, which will be held in Tampa (Florida), December 5 – 8, 2022. You can meet our team members at the booth 332 in the expo area, and find out why our MIP decapsulation tool would be an indispensable asset in your failure analysis flow. DMC is the US annual forum for enhancing and leveraging the efforts of engineers, managers, technology leaders, scientists, and policy makers across the defense manufacturing industrial base. More details on this event are available via link.
Should you want to know more in advance about our MIP decapsulation solution, or would like to meet with us separately, feel free to reach out via email address: info@jiaco-instruments.com
