JEDEC has recently updated the standard on wire bond pull test methods (JESD22-B120), adding guidance in Annex B for performing decapsulation on devices prior to bond pull testing. JESD22-B120 test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. The document can be downloaded via link (after a mandatory registration on JEDEC website).
Microwave Induced Plasma (MIP) has been recognized by JEDEC as a decapsulation technique suitable for preservation of integrity of copper and silver wires. Decapsulation procedures developed for gold wire bonds are rarely suitable for more recent wire bond materials and tend to cause thinning, corrosion or even complete removal of wires and/or bonds. MIP process consisting of a plasma etching and ultrasonic cleaning step has been recommended as a technique which preserves all wire materials in their original state, thus ensuring a reliable bond pull test data after the decapsulation.
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