For the first time, the 30th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2023) is coming to Penang, Malaysia. IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device/circuit/module failure that serves as a critical input for future design for reliability.
JIACO Instruments artifact-free Microwave Induced Plasma (MIP) decapsulation technology will be demonstrated in a number of novel papers at this years conference, including:
4A.4 : Oxygen-Based Microwave Induced Plasma Etching for Epoxy Molding Compound Removal in Advanced Semiconductor Devices, author Hong Siang Tan of AMD at 11:30 AM – 11:50 AM on Wednesday, July 26th
[P4 ID – 105] Optimization of Microwave Induced Plasma Etching Process for Decapsulation of Multi-Tier PCC Wire-Bonded Semiconductor Devices, author Chiun Ning Liew of Intel Microelectronics, Malaysia during the Package-Level Failure Analysis poster session on Wednesday, July 26th
JIACO Instruments will also participate in the exhibition, make sure to stop by booth B1 during the exhibition periods. Our team will be glad to introduce our artifact-free Microwave Induced Plasma (MIP) decapsulation technology and advise on how its application range can meet your requirements in physical failure analysis.
Contact us at firstname.lastname@example.org if you would like to know more beforehand and/or would like to meet with us separately (before, during or after IPFA).
Registration for IPFA is open until July 10th. Register here.