ISTFA 2018

ISTFA 2018

ISTFA 2018

“Preserving Evidence for Root Cause Investigations with Halogen-Free Microwave Induced Plasma Decapsulation”
Dr. Charles A. Odegard, Mr. Andy Burnett, Dr. Jiaqi Tang and Ms. Jing Wang
Proceedings from the 44th International Symposium for Testing and Failure Analysis (ISTFA 2018)

This work is done in collaboration with Texas Instruments.

Abstract:

Accurate root cause determination of integrated circuit devices necessitates the preservation of evidence during failure analysis. Identifying the cause of systemic defects requires capturing physical evidence provided by very few customer returns. Each piece of physical evidence is valuable due to the scarcity of returns in most cases less than 1 ppm. Harvesting infrequent physical evidence requires that each attempt to decapsulate a fail unit has a high probability of retaining the material that caused the defect. A measured method that retains the critical evidence is the fastest way to solve a defect driven systemic failure mechanism because one gathers the evidence more efficiently.


Link to the document






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