MIP | Plasma IC decapsulation
The global standard for tackling the semiconductor industry’s most demanding IC decap challenges. Request information
Patented Silver (Ag) Wire IC Decapsulation
The system has been proven for decapsulation of Cu, PCC, Ag, Au bond wired devices. Our patented Ag MIP plasma preserves silver wire and silver alloys during IC decap.
EOS Decapsulation
Clean exposure and excellent preservation of Contamination and Electrical Overstress (EOS). Preserve your samples and get every analysis right the first time.
Advanced Package Types Decapsulation
Advanced package types like 3D, SiP WLCSP, BOAC are successfully decapped without process-induced damage.
Localized MIP removal of PI/PBO
Fast and localized removal of Polyimides (PI) and Polybenzoxazoles (PBO) without damage to the underlying die and preserving the copper (Cu) Redistribution layer (RDL).
Preserve your samples
Preserve your samples and get every analysis right the first time. Acid decap can cause corrosion and wash away failure sites leading to doubt about the root cause of the failure.
The JEDEC Standard
Microwave Induced Plasma (MIP) has been recognized by JEDEC as a decapsulation technique suitable for preservation of integrity of copper and silver wires.