JIACO Instruments at IMAPS 16th International Conference and Exhibition on Device Packaging 2020 Booth 13: See our machine, discuss potential Contact us at info@jiaco-instruments.com if you […]
Together with our customer Hirex Engineering during ISTFA 2019, Dr. Jiaqi Tang presented JIACO Instruments patent-pending Ag silver wire plasma decapsulation process. The paper entitled ‘Artifact-Free Decapsulation of […]
JIACO Instruments held the inaugural MIP user group meeting. On November 10th, JIACO Instruments held the inaugural MIP user group meeting before the official ISTFA 2019 […]
JIACO Instruments joins European project focusing on power semiconductor devices The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight […]
MASER Engineering expands decapsulation capability for failure analysis with second MIP Machine from JIACO Instruments “Maser has been a partner with Jiaco Instruments since the initial […]
JIACO Instruments, a Platinum Sponsor, at the 2019 PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE) Conference. Visit JIACO Instruments to discuss how atmospheric O2-only decapsulation enables […]