JIACO Instruments, a Platinum Sponsor, at the 2019
PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE) Conference.

• Visit JIACO Instruments to discuss how atmospheric O2-only decapsulation enables the further physical inspection of your devices without process induced damage (eg corroded/missing bond wires) or electrical damage to ensure your devices data is still readable/accessible for your further analysis;
• We would be glad to discuss our extensive MIP applications range across the latest mobile packaging types ;