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12 April 2024

JIACO Instruments at Automotive Electronics Council (AEC) Workshop 2024, April 23 – 25, Novi, MI

Hear JIACO Instruments latest research on Improving the Wire Pull Test& Failure Analysis for Copper Wired Components, 2PM Wednesday April 24th The Automotive Electronics Council (AEC) […]

21 February 2023

MIP decapsulation included in JEDEC standard on wire bond pull test methods

MIP decapsulation included in JEDEC standard on wire bond pull test methods JEDEC has recently updated the standard on wire bond pull test methods (JESD22-B120), adding […]