Wire bond pull
10 October 2024
Visit JIACO Instruments at booth 609 in the exhibition hall Join JIACO Instruments at the 50th anniversary of ISTFA at the Hilton Bay View Hotel in […]
12 April 2024
Hear JIACO Instruments latest research on Improving the Wire Pull Test& Failure Analysis for Copper Wired Components, 2PM Wednesday April 24th The Automotive Electronics Council (AEC) […]
21 February 2023
MIP decapsulation included in JEDEC standard on wire bond pull test methods JEDEC has recently updated the standard on wire bond pull test methods (JESD22-B120), adding […]