With gold prices hitting record-highs, the transition from gold to alternative wire bond materials is increasing. Where gold can withstand acid decapsulation, substitute materials such as […]
𝗙𝗿𝗼𝗺 𝗡𝗼𝘃𝗲𝗺𝗯𝗲𝗿 𝟭𝟲𝘁𝗵–𝟮𝟬𝘁𝗵, our colleagues Jiaqi Tang, Yashan Peng, Ruben Tibben, Sarah Zerouali and Mark McKinnon will be attending ISTFA 2025 in Pasadena, CA, USA! ISTFA’s […]
JIACO Instruments Microwave Induced Plasma (MIP) technology extends Failure Analysis where traditional decapsulation methods cannot. Traditional decapsulation methods, such as acid decapsulation, often damage your sample […]
From the 29th of September to the 3rd of October, our colleague Sarah Zerouali will be attending this year’s edition of The RADiation and its Effects […]
ESREF 2025 (European Symposium on Reliability of Electron Devices, Failure Physics and Analysis) will be taking place from October 6-9 in UNESCO’s appointed city of Art […]
At IPFA 2023, Nanyang Technological University presented “Hardware Security Assessment through Repair of Damaged Device,” demonstrating how dies from a damaged SD card, when decapsulated using […]
Over 50% of medical devices contain electronic components, the working of these components are vital in patient care, diagnosis, and treatment. The integration of semiconductors in […]