Request information
Home
MIP Systems
Plasma IC Decapsulation (MIP)
Plasma Die-level Etching (MIP+)
Decapsulation Technology
Applications & Publications
News
About us
Job Openings
Contact
AEC Q006
Home
News
AEC Q006
Filter by
Categories
Tags
Authors
Show all
All
Archive
conferences
All
2.5D
advanced packaging
AEC
AEC Q006
cam workshop
CoWoS
cyber security
decapsulation
ECTC
EMIB
ESREF
ESREF conference
failure analysis
hardware assurance
IPFA
ISTFA
JEDEC
JIACO Instruments
microwave induced plasma
MIP decapsulation
physical inspection
reliability test
reverse engineering
semiconductor packaging
Wire bond pull
All
Lance Fordham
Mark
Wendy
12 April 2024
JIACO Instruments at Automotive Electronics Council (AEC) Workshop 2024, April 23 – 25, Novi, MI
Hear JIACO Instruments latest research on Improving the Wire Pull Test& Failure Analysis for Copper Wired Components, 2PM Wednesday April 24th The Automotive Electronics Council (AEC)
[…]
