Presenting our latest research on decapsulation of semiconductor devices with Silver (Ag) bond utilizing JIACO Instruments MIP decapsulation
Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after ISTFA)
Details about the presentation of our paper:
Thursday, November 14th, 2019
08:00 AM
Session Sample Preparation and Device Deprocessing:
Co-authored with our partner HIREX Engineering
Paper authors:
Dr. Jiaqi Tang, JIACO Instruments B.V., Delft, Netherlands
Ms. Jing Wang, JIACO Instruments B.V., Delft, Netherlands
Drs Wilbert van den Hoek, JIACO Instruments B.V., Delft, Netherlands
Mr David Lojier, Hirex Engineering, Toulouse, France
Mr Bertrand Forgerit, Hirex Engineering, Toulouse, France
Mr Guillaume Gabaston, Hirex Engineering, Toulouse, France
Professor Kees Beenakker, Delft University of Technology