Visit JIACO Instruments to discuss damage free decapsulation

• Booth 315: See our machine, discuss potential
• Session: Sample Preparation and Device Deprocessing (Nov 14, Thursday):

Presenting our latest research on decapsulation of semiconductor devices with Silver (Ag) bond utilizing JIACO Instruments MIP decapsulation

Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after ISTFA)

• Join us in the Tools of the Trade from 5pm on Monday the 11th
• Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements.
• Discuss how to handle Ag wire, Cu wire, 3D IC, SiP, WLCSP, automotive package, fresh & thermally stressed devices etc. with our novel MIP decapsulation technology.

Details about the presentation of our paper:

Thursday, November 14^th, 2019

08:00 AM
Session Sample Preparation and Device Deprocessing:

Artifact-Free Decapsulation of Silver Wire Bonded Semiconductor Devices Using Microwave Induced Plasma

Co-authored with our partner HIREX Engineering

Paper authors:

Dr. Jiaqi Tang, JIACO Instruments B.V., Delft, Netherlands

Ms. Jing Wang, JIACO Instruments B.V., Delft, Netherlands

Drs Wilbert van den Hoek, JIACO Instruments B.V., Delft, Netherlands

Mr David Lojier, Hirex Engineering, Toulouse, France

Mr Bertrand Forgerit, Hirex Engineering, Toulouse, France

Mr Guillaume Gabaston, Hirex Engineering, Toulouse, France

Professor Kees Beenakker, Delft University of Technology