9 February 2022

JIACO Instruments at IMAPS DPC conference 2022, March 7 – 10, Fountain Hills, Arizona

Visit us on exhibition days at booth 36 We are delighted to announce that we will be joining 18th annual Device Packaging Conference (DPC 2022), held in Fountain […]
22 November 2021

EDFA Magazine article on Microwave Induced Plasma (MIP) removal of interposer overmold in 2.5D packages

GlobalFoundries have recently published an article with a title “Methods to Enable Fault Isolation on 2.5D Molded Interposer Packages”. This publication is available in November issue […]
1 October 2021

JIACO Instruments at ISTFA conference 2021, Oct 31 – Nov 4, Phoenix, Arizona

Visit JIACO Instruments to discuss artifact-free decapsulation Booth 818: See our machine, discuss potential collaboration Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or […]
8 February 2021

JIACO Instruments joins iRel40

JIACO Instruments is now a part of European research project which aims to improve the reliability of electronic components for future applications The Europe-wide research initiative […]
1 February 2021

EDFA Magazine article on atmospheric oxygen-only plasma for decapsulation

Our article “Enabling True Root Cause Failure Analysis Using an Atmospheric Oxygen-Only Plasma for Decapsulation of Advanced Packages” is now available in digital edition of EDFA […]
29 September 2020

JIACO Instruments at iMAPS 2020 virtual exhibit hall – October 5-8

See our machine, discuss potential decapsulation solutions via the live chat function! Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements […]
27 February 2020
IMAPS International Conference on Device Packaging

JIACO Instruments at IMAPS 16th International Conference and Exhibition on Device Packaging 2020, March 2-5, Nov 11 to 14, Fountain Hills, Arizona USA

JIACO Instruments at IMAPS 16th International Conference and Exhibition on Device Packaging 2020 Booth 13: See our machine, discuss potential Contact us at info@jiaco-instruments.com if you […]
3 February 2020
Chip Targets Business Manager, Peter Nguyen, signs the contract with JIACO Instruments CEO, Rene van Eijkelenburg, at the ISTFA 2019

Chip Targets becomes the first Failure Analysis Service Lab in the US to offer atmospheric Microwave Induced Plasma (MIP) decapsulation services

Chip Targets joins MASER Engineering (The Netherlands) & Hirex Engineering (France) in offering MIP decapsulation services. Delft, the Netherlands, February 3rd, 2020 Chip Targets is pleased […]
19 January 2020
ISTFA 2019 – Silver Wire Ball Bond and Stitch Bond - MIP Decapsulation – JIACO Instruments

JIACO Instruments presents patent-pending Ag silver wire plasma decapsulation process at ISTFA 2019

Together with our customer Hirex Engineering during ISTFA 2019, Dr. Jiaqi Tang presented JIACO Instruments patent-pending Ag silver wire plasma decapsulation process. The paper entitled ‘Artifact-Free Decapsulation of […]