See our machine, discuss potential decapsulation solutions via the live chat function!
Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements for reliability test, quality control & failure analysis
Discuss how to decapsulate 2.5D, Ag wire, Cu wire, 3D IC, SiP, WLCSP, GaN, GaAs, automotive package, fresh & thermally stressed devices etc. with our novel atmospheric pressure artifact-free decapsulation technology
Contact us at firstname.lastname@example.org if you would like to know more beforehand and/or would like to schedule a time to speak before, during or after IMAPS