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Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements for reliability test, quality control & failure analysis
Discuss how to decapsulate 2.5D, Ag wire, Cu wire, 3D IC, SiP, WLCSP, GaN, GaAs, automotive package, fresh & thermally stressed devices etc. with our novel atmospheric pressure artifact-free decapsulation technology
Contact us at email@example.com if you would like to know more beforehand and/or would like to schedule a time to speak before, during or after IMAPS