See our machine, discuss potential decapsulation solutions via the live chat function!
- Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements for reliability test, quality control & failure analysis
- Discuss how to decapsulate 2.5D, Ag wire, Cu wire, 3D IC, SiP, WLCSP, GaN, GaAs, automotive package, fresh & thermally stressed devices etc. with our novel atmospheric pressure artifact-free decapsulation technology
- Contact us at email@example.com if you would like to know more beforehand and/or would like to schedule a time to speak before, during or after IMAPS
Visit iMaps at: https://www.imaps.org/international_symposium_on_mic.php