Our article “Enabling True Root Cause Failure Analysis Using an Atmospheric Oxygen-Only Plasma for Decapsulation of Advanced Packages” is now available in digital edition of EDFA Magazine (Volume 23, Issue 1).

Case studies presented in this article show that the success rate of preserving the material which causes failure mechanisms can be greatly improved by moving away from aggressive methods to decapsulate samples and replacing them with more selective and environmentally-friendly decapsulation technologies, such as atching at atmospheric pressure by Microwave Induced Plasma (MIP). Moreover, JIACO Instruments’ MIP technology also provides a unique capability in complex advanced packaging decapsulation, ensuring a high success rate of the related failure analyses.

Read the full article via link: https://static.asminternational.org/EDFA/202102/4/