From the 5th – 8th of August, our colleagues Yashan Peng and Mark McKinnon were present at 2025’s edition of IPFA in Penang, Malaysia!  Yashan Peng […]

On August 6th in Shangai, China, Kees Beenakker had the honour of holding a plenary talk at ICEPT 2025.   In his plenary talk Prof. Beenakker […]

Removing underfill in your devices, whether they are 2.5D/3D advanced packages, flipchips etc, enables further analysis on your samples, but can be quite challenging using traditional […]

We are excited to announce that the 1st JIACO Instruments MIP machine in Japan is now operational!   This installation marks a key milestone for JIACO […]

During this year’s IPFA conference we are excited to present a new paper with our customer Infineon Technologies ‘𝘙𝘦𝘷𝘰𝘭𝘶𝘵𝘪𝘰𝘯𝘪𝘻𝘪𝘯𝘨 𝘐𝘊 𝘗𝘢𝘤𝘬𝘢𝘨𝘦 𝘋𝘦𝘤𝘢𝘱𝘴𝘶𝘭𝘢𝘵𝘪𝘰𝘯 𝘸𝘪𝘵𝘩 𝘔𝘪𝘤𝘳𝘰𝘸𝘢𝘷𝘦-𝘐𝘯𝘥𝘶𝘤𝘦𝘥-𝘗𝘭𝘢𝘴𝘮𝘢 (𝘔𝘐𝘗) 𝘚𝘺𝘴𝘵𝘦𝘮’, […]

Prof. Kees Beenakker, co-founder of JIACO Instruments, will be a Plenary Talks speaker at ICEPT 2025, sharing insights from over 40 years of semiconductor packaging evolution.  […]

We’re excited to announce that JIACO Instruments has been invited to present at the Sample Preparation User Group Meeting during the upcoming IPFA 2025 (International Symposium […]

Radiation testing of semiconductors is crucial for devices used in environments with high radiation exposure, such as space or nuclear facilities. Understanding how radiation impacts your […]

With significant momentum as the next breakthrough in semiconductor technology, the advanced packaging industry is experiencing rapid growth.We’re excited to announce that another leader in advanced […]