Request information
Home
MIP Systems
Plasma IC Decapsulation (MIP)
Plasma Die-level Etching (MIP+)
Decapsulation Technology
Applications & Publications
News
About us
Job Openings
Contact
reverse engineering
Home
News
reverse engineering
Filter by
Categories
Tags
Authors
Show all
All
Archive
conferences
All
AEC
AEC Q006
cam workshop
cyber security
decapsulation
ESREF
ESREF conference
failure analysis
hardware assurance
IPFA
ISTFA
JEDEC
JIACO Instruments
microwave induced plasma
MIP decapsulation
physical inspection
reliability test
reverse engineering
Wire bond pull
All
jiaco
Lance Fordham
Mark
Wendy
21 February 2025
JIACO Instruments at the 3rd Hardware Reverse Engineering Workshop (HARRIS 2025) 17-18th March in Bochum, Germany
Meet with JIACO Instruments during HARRIS JIACO Instruments is proud to be sponsoring the 3rd Hardware Reverse Engineering Workshop in Bochum, Germany on March 17 &
[…]
