With significant momentum as the next breakthrough in semiconductor technology, the advanced packaging industry is experiencing rapid growth.
We’re excited to announce that another leader in advanced packaging has selected our MIP technology to support their continued growth.

As demonstrated in our recent plublications on advanced packaging, the MIP machine is invaluable for AI and advanced packaging, providing a way to get artifact free sample preparation for failure analysis and reliability testing.
We look forward to supporting the continued growth in advanced packaging with our atmospheric plasma systems!

𝘞𝘢𝘯𝘵 𝘵𝘰 𝘭𝘦𝘢𝘳𝘯 𝘮𝘰𝘳𝘦 𝘢𝘣𝘰𝘶𝘵 𝘰𝘶𝘳 𝘴𝘰𝘭𝘶𝘵𝘪𝘰𝘯𝘴 𝘧𝘰𝘳 𝘧𝘢𝘪𝘭𝘶𝘳𝘦 𝘢𝘯𝘢𝘭𝘺𝘴𝘪𝘴 𝘢𝘯𝘥 𝘴𝘢𝘮𝘱𝘭𝘦 𝘱𝘳𝘦𝘱𝘢𝘳𝘢𝘵𝘪𝘰𝘯?
info@jiaco-instruments.com