CMSE conference 2019, Los Angeles – JIACO Instruments17 April 2019
JIACO Instruments at the PAINE Conference, Washington D.C., July 23 and 24.2 July 2019
JIACO Instruments at the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Contact us at firstname.lastname@example.org if you would like to know more beforehand and/or would like to meet with us separately (before, during or after IPFA)
- Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements.
- Discuss novel failure analysis case studies such as: Preserving contamination and corrosion; Preservation of original failure sites for wire-bonded devices; Decapping tough (High Tg) mold compounds plus other applications with our novel MIP decapsulation technology.
- Please contact Mark on email@example.com if you would like to meet separately (before, during or after IPFA)