JIACO Instruments at IPFA 2019, July 2 to 5, Hangzhou, China.
CMSE conference 2019, Los Angeles – JIACO Instruments
17 April 2019
JIACO Instruments at the PAINE Conference, Washington D.C., July 23 and 24.
2 July 2019
JIACO Instruments at the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Booth 11
Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after IPFA)
- Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements.
- Discuss novel failure analysis case studies such as: Preserving contamination and corrosion; Preservation of original failure sites for wire-bonded devices; Decapping tough (High Tg) mold compounds plus other applications with our novel MIP decapsulation technology.
- Please contact Mark on info@jiaco-instruments.com if you would like to meet separately (before, during or after IPFA)
