JIACO Instruments at the PAINE Conference, Washington D.C., July 23 and 24.
JIACO Instruments at IPFA 2019, July 2 to 5, Hangzhou, China.
6 June 2019
JIACO Instruments, IPFA 2019
3 July 2019
JIACO Instruments at International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE), July 23 & 24th at the Crystal City Marriott (Washington, D.C. area), USA
- Visit JIACO Instruments to discuss how atmospheric O2-only decapsulation enables the further physical inspection of your devices without process induced damage (eg corroded/missing bond wires) or electrical damage to ensure your devices data is still readable/accessible for your further analysis;
- We would be glad to discuss our extensive MIP applications range across the latest mobile packaging types ;
- JIACO Instruments is a platinum sponsor. Visit us at our table in the foyer of the conference.
- Please contact Mark on info@jiaco-instruments.com if you would like to meet separately (before, during or after PAINE)
