CAM Workshop 2019, Halle, Germany – JIACO Instruments10 April 2019
JIACO Instruments at IPFA 2019, July 2 to 5, Hangzhou, China.6 June 2019
JIACO Instruments is at booth B1 of the CMSE 2019 conference in Los Angeles. Stop by our booth and talk with Mark McKinnon about how we can assist with your challenging semiconductor decapsulation requirements.
Additionally, discuss how to expose ball & stitch bonds, handle tough automotive High Tg mold compounds, Cu wire Ag wire & stitch bond plating etc. with our novel MIP decapsulation technology.