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Details about the presentation of our paper:
Session Copper Wirebond Technology Panel Discussion:
Applications of MIP Decapsulation in Device Quality Control and Failure Analysis
Dr. Jiaqi Tang, JIACO Instruments B.V., Delft, Netherlands
Mr. James McEwen, Oneida Research Services, Inc.
Ms. Jing Wang, JIACO Instruments B.V., Delft, Netherlands
Prof. Dr. Kees Beenakker, Delft University of Technology, Delft, Netherlands