JIACO Instruments at IPFA Conference 2018, July 17 to 19, Singapore:
- Booth A22: See our machine, discuss potential
- Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements
- Discuss how to handle Ag wire, Cu wire, 3D IC, SiP, WLCSP etc. with our novel MIP decapsulation technology
Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us separately (before, during or after IPFA).