JIACO Instruments at ISTFA conference 2017, 5-9 November, Pasadena
20 October 2017JIACO Instruments at CMSE Conference 2018, May 7 to 10, Los Angeles
1 May 2018
JIACO Instruments at CAM workshop, Apr 25 & 26, Halle, Germany
- Presenting “Applications of MIP Decapsulation in Device Quality Control and Failure Analysis” in Session 3: Sample Preparation at 17:30 on Wednesday, 25.04.2018.
- Exhibiting at booth #4.
- Discuss how to handle 3D IC, SiP, Cu wire, Ag wire, WLCSP, automotive packages etc. with our novel MIP decapsulation technology.
- Speak to JIACO Instruments about your challenging decapsulation requirements