Contact us at firstname.lastname@example.org you want to know more beforehand and/or would like to meet with us separately (before, during or after CAM-Workshop).
IMAPS International Conference on Device Packaging
Chip Targets Business Manager, Peter Nguyen, signs the contract with
JIACO Instruments CEO, Rene van Eijkelenburg, at the ISTFA 2019
ISTFA 2019 – Silver Wire Ball Bond and Stitch Bond - MIP Decapsulation – JIACO Instruments