JIACO Instruments at SEMICON China 2017, 14-16 March, Shanghai
1 March 2017JIACO Instruments at PSECE conference 2017, 21-23 June, Manila
10 June 2017
JIACO Instruments at CAM workshop
- Presenting “Microwave Induced Plasma Decapsulation of System in Package Devices” at 16:20-16:40 on Wednesday 26th of April.
- Exhibiting at booth #10
- Speak to JIACO Instruments about your challenging decapsulation requirements
- Discuss how to handle 3D IC, SiP, Cu wire, Ag wire, WLCSP, automotive packages etc. with our novel MIP decapsulation technology
Contact us at info@jiaco-instruments.comif you want to know more beforehand and/or would like to meet with us separately (before, during or after CAM-Workshop).