JIACO Instruments at PSECE conference 2017
- Presenting “State-of-the-art Semiconductor Decapsulation Tool: MIP” at 11:30 at area 1 on Thursday 22th of Jun.
- Booth #23:See our machine, discuss potential
- Discuss how to handle 3D IC, SiP, Cu wire, Ag wire, WLCSP, automotive packages etc. with our novel MIP decapsulation technology
Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us separately (before, during or after PSECE).