JIACO Instruments at IPFA conference 2017

• Booth #4: See our machine, discuss potential
• Session Sample Preparation, Metrology and Defect Characterization I (July 5, Wednesday): Presenting our latest research on EOS and contamination failure analysis
• Discuss how to handle 3D IC, SiP, Cu wire, Ag wire, WLCSP, automotive packages etc. with our novel MIP decapsulation technology

Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us separately (before, during or after IPFA)

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Details about the presentation of our paper:

Wednesday, July 5, 2017

14:40-15:00pm

Sample Preparation, Metrology and Defect Characterization I:

Unique Failure Analysis Capabilities Enabled by the MIP Decapsulation Technique

Jiaqi Tang and Jing Wang- JIACO Instruments B.V.

Wang, C. Liu – Huawei Technologies Co., Ltd.

Prof. Dr. Kees Beenakker – Delft University of Technology