JIACO Instruments at SEMICON China 2017, 14-16 March, Shanghai
- Located in Hall W3, booth #3725
- Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements.
- Discuss how to handle Ag wire, Cu wire, 3D IC, SiP, WLCSP, automotive package etc. with our novel MIP decapsulation technology.
- We speak Chinese and English at SEMICON China.
Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us separately (before, during or after SEMICON China).