MASER Engineering begins operation of advanced decapsulation technology
12 September 2016
JIACO Instruments at SEMICON China 2017, 14-16 March, Shanghai
1 March 2017
JIACO Instruments at ISTFA conference 2016, 6-10 November, Fort Worth
- Booth 103: See our machine, discuss potential
- Session Sample Preparation and Device Deprocessing (Monday): Presenting our latest research on Automotive Semiconductor Device Decapsulation
Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after ISTFA)
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Details about the presentation of our paper:
Monday, November 7, 2016
1:00 PM
Session Sample Preparation and Device Deprocessing (Meeting Room 108)
CF4-free Microwave Induced Plasma Decapsulation of Automotive Semiconductor Devices
Dr. Jiaqi Tang JIACO Instruments B.V.
Mr. G. B. Anderson, Infineon Technologies, Livonia, MI
Ms. Jing Wang, JIACO Instruments B.V., Delft, Netherlands
Johannes Bruckmeier, Infineon Technologies Munich, Neubiberg, Germany
Ms. Claudia Keller, Infineon Technologies Munich, Neubiberg, Germany
Genny V. Dela Cruz, Infineon Technologies Singapore, Kallang Sector, Singapore
Prof. Dr. Kees Beenakker, Delft University of Technology, Delft, Netherlands
