JIACO Instruments at IPFA conference 2016, 18-21 July, Singapore1 July 2016
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MASER Engineering begins operation of advanced decapsulation technology
MASER Engineering begins operation of advanced decapsulation technology Enschede, the Netherlands September 12th, 2016 MASER Engineering and JIACO Instruments are pleased to announce that the JIACO Instruments Microwave Induced Plasma (MIP) decapsulation system is operational and released by MASER Engineering, located in Enschede, The Netherlands. MASER Engineering, with more than 25 years of experience in IC FA, supported JIACO Instruments in the development and beta site testing of the MIP system.
JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilizing O2-only recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for advanced package types like 3D, SiP, WLCSP, high Tg, Chip on Board, BOAC; all without process induced damage for reliable failure analysis and quality control.
Prof. Dr. Kees Beenakker, developer of the MIP technology, Dr. Jiaqi Tang, CEO of JIACO Instruments and Mr, Kees Revenberg, Managing Director of MASER Engineering officially released the MIP system at MASER Engineering on September 12, 2016.
“Together with MASER Engineering and our mechatronics partner we have successfully developed an advanced decapsulation process to handle the most advanced IC packages for the semiconductor market”, Dr. Jiaqi Tang, CEO of JIACO Instruments commented. “MASER Engineering supported JIACO Instruments during the development of the first prototype with almost 25 year of experience in IC failure analysis. We are pleased with the co-development process and the performance of the MIP system”, Kees Revenberg Managing Director of MASER Engineering acknowledged.
MASER Engineering can support customers to perform MIP decapsulation of standard packages and perform decapsulation trails in case of new type of packages (e.g. new type of molding compounds)