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Details about the presentation of our paper:
Thursday, July.21, 2016
Session Sample Preparation, Metrology and Defect Characterization II:
Decapsulation of Copper Wire Devices with High Tg Mold Compound Using Microwave Induced Plasma
Jiaqi Tang and Jing Wang- JIACO Instruments B.V.
T.H. Tan, M. Endo, K.M. Ng and L.C. Lee – Sumitomo Bakelite
Prof. Dr. Kees Beenakker – Delft University of Technology