JIACO Instruments at IPFA conference 2016, 18-21 July, Singapore:

• Booth A09: See our machine, discuss potential
• Session Sample Preparation, Metrology and Defect Characterization II (Thursday):
• Presenting our latest research on Decapsulation of High Tg Mold Compound

Contact us at info@jiaco-instruments.com if you want to know more beforehand and/or would like to meet with us separately (before, during or after IPFA)

Distributors wanted: We are looking for distributors in Asia. If you believe you have the relevant industry experience and an established customer base, please contact us before IPFA so we can arrange meeting during IPFA.

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Details about the presentation of our paper:

Thursday, July.21, 2016

15:15-16:55pm

Session Sample Preparation, Metrology and Defect Characterization II:

Decapsulation of Copper Wire Devices with High Tg Mold Compound Using Microwave Induced Plasma

Jiaqi Tang and Jing Wang- JIACO Instruments B.V.

T.H. Tan, M. Endo, K.M. Ng and L.C. Lee – Sumitomo Bakelite

Prof. Dr. Kees Beenakker – Delft University of Technology