The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Our team will be available at this year’s ECTC to discuss our Microwave Induced Plasma decapsulation technology and its applicability to your most challenging packages. We’ll be glad to welcome you at booth 611 on one of the following days:
Contact us at firstname.lastname@example.org if you would like to know more beforehand and/or would like to meet with us separately (before, during or after ECTC conference).
Read more about this year’s edition of ECTC via link: https://www.ectc.net/index.cfm