JIACO Instruments at IMAPS DPC conference 2022, March 7 – 10, Fountain Hills, Arizona
EDFA Magazine article on Microwave Induced Plasma (MIP) removal of interposer overmold in 2.5D packages
22 November 2021
JIACO Instruments at ECTC 2022 (IEEE 72nd Electronic Components and Technology Conference), May 31 – June 3, San Diego, California
19 April 2022
Visit us on exhibition days at booth 36
We are delighted to announce that we will be joining 18th annual Device Packaging Conference (DPC 2022), held in Fountain Hills, Arizona, from March 7-10, 2022. DPC is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
We are looking forward to discussing how our Microwave Induced Plasma decapsulation technology can be proven on your most challenging packages. Our team will be available for your questions throughout exhibition days on:
- Tuesday, March 8, between 10 AM and 6 PM, or
- Wednesday, March 9, between 10 AM and 4 PM.
Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after IMAPS DPC conference).
