We are delighted to announce that we will be joining 18th annual Device Packaging Conference (DPC 2022), held in Fountain Hills, Arizona, from March 7-10, 2022. DPC is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
We are looking forward to discussing how our Microwave Induced Plasma decapsulation technology can be proven on your most challenging packages. Our team will be available for your questions throughout exhibition days on:
Contact us at firstname.lastname@example.org if you would like to know more beforehand and/or would like to meet with us separately (before, during or after IMAPS DPC conference).