JIACO Instruments at CAM workshop, Apr 10 & 11, Halle, Germany
JIACO Instruments at ISTFA conference 2018, Oct 28 to Nov 1, Phoenix
10 October 2018
JIACO Instruments at CMSE conference 2019, April 16 to 18, Los Angeles
1 March 2019
JIACO Instruments at CAM workshop, April 10 & 11, Halle, Germany
Exhibiting at booth #8
Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after CAM Workshop)
- Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements.
- Discuss how to handle tough automotive High Tg mold compounds, Ag wire & stitch bond plating, Cu wire, 3D IC, SiP, WLCSP etc. with our novel MIP decapsulation technology.
- Please contact Mark on info@jiaco-instruments.com if you would like to meet separately (before, during or after CAM Workshop)
