JIACO Instruments at CMSE conference 2019, April 16 to 18, Los Angeles
Booth B1
Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would like to meet with us separately (before, during or after CMSE)
- Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements.
- Discuss how to expose ball & stitch bonds, handle tough automotive High Tg mold compounds, Cu wire Ag wire & stitch bond plating etc. with our novel MIP decapsulation technology.
- Please contact Mark on info@jiaco-instruments.com if you would like to meet separately (before, during or after CMSE)