Our MIP machine is a breakthrough for failure analysis and quality control in copper wired IC package decapsulation.
Come see for yourself and talk to us about testing your devices on our machine.
Seeing is believing…
Contact us at firstname.lastname@example.org if you want to know more beforehand and/or would like to meet with us separately (before, during or after ECTC).
Details about the presentation of our paper:
Thursday, May 28, 2015
Session 19: 3D Technology: Thermal and Performance Reliability
Committee: Advanced Packaging joint with Applied Reliability
Room: Harbor Island 1
Paper7 at 4:45 PM
Failure Analysis of Complex 3D Stacked-Die IC Packages using Microwave Induced Plasma Afterglow Decapsulation
Jiaqi Tang – JIACO Instruments B.V.
Mitch Curiel – Freescale Semiconductor
Sharon Furcone – Freescale Semiconductor
Ewald Reinders – Maser Engineering
Kees Revenberg – Maser Engineering
Kees Beenakker – Delft University of Technology