JIACO Instruments joins iRel408 February 2021
EDFA Magazine article on Microwave Induced Plasma (MIP) removal of interposer overmold in 2.5D packages22 November 2021
Visit JIACO Instruments to discuss artifact-free decapsulation
us at email@example.com if
you would like to know more beforehand and/or would like to meet with us
separately (before, during or after ISTFA)
- Join us in the Tools of the Trade from 5 pm on Monday, November 1
- Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements.
- Discuss how to handle Ag wire, Cu wire, 2.5D & 3D packages, SiP, WLCSP, GaAs, automotive packages, fresh & thermally stressed devices etc. with our novel atmospheric MIP decapsulation technology.