Removing underfill in your devices, whether they are 2.5D/3D advanced packages, flipchips etc, enables further analysis on your samples, but can be quite challenging using traditional chemical processes.
As demonstrated in many of our recent papers, our MIP & MIP+ systems can etch UnderFill (UF) material in various locations on the package to expose & preserve various materials, including:

– the μbump chains in the interposer
– HBM overmold
– Solder balls
– Cu RDL

Our industry leadership in underfill etching, is due to the unique advantages of JIACO Instrument’s MIP systems:

– Atmospheric, CF₄-free plasma for decapsualtion/UF etching
– High selectivity
– No artifacts introduced to your sample

Allowing you to perform your analysis of the sample right the first time.

𝗥𝗲𝗮𝗱 𝗺𝗼𝗿𝗲 𝗮𝗯𝗼𝘂𝘁 𝗵𝗼𝘄 𝘁𝗵𝗲 𝗠𝗜𝗣 𝗵𝗮𝗻𝗱𝗹𝗲𝘀 𝘂𝗻𝗱𝗲𝗿𝗳𝗶𝗹𝗹 𝗲𝘁𝗰𝗵𝗶𝗻𝗴:
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Get in touch!
Info@jiaco-instruments.com