The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) will be held in Marina Bay Sands, Singapore. IPFA focuses on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device / circuit / module failure that serves as critical input for future design for reliability.
Our team will attend this event in person, and hereby we’re inviting you to visit us at the booth B1, where we’ll be available to introduce you to our Microwave Induced Plasma (MIP) decapsulation technology and its wide application range.
Contact us at firstname.lastname@example.org if you would like to know more beforehand and/or would like to meet with us separately (before, during or after IPFA).
Read more about this event via link: https://www.ipfa-ieee.org/2022/