Archive
3 July 2019
JIACO Instruments at IPFA 2019 Meet our co-founder and CTO, Jiaqi Tang, at booth B11 at IPFA 2019, about how we can assist with your challenging […]
2 July 2019
JIACO Instruments at International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE), July 23 & 24th at the Crystal City Marriott (Washington, D.C. area), USA […]
6 June 2019
JIACO Instruments at the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Booth 11Contact us at info@jiaco-instruments.com if you would like to know […]
10 April 2019
JIACO Instruments is exhibiting at the CAM Workshop in Halle Germany. Stop by booth #8 to discuss your decapsulation challenges with Lance Fordham and Mark McKinnon. […]
1 March 2019
JIACO Instruments at CMSE conference 2019, April 16 to 18, Los Angeles Booth B1 Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or would […]
1 March 2019
JIACO Instruments at CAM workshop, April 10 & 11, Halle, Germany Exhibiting at booth #8 Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or […]
10 October 2018
JIACO Instruments at ISTFA conference 2018, Oct 28 to Nov 1, Phoenix Booth 215:See our machine, discuss potential Session: Sample Preparation and Device Deprocessing II (Oct […]
1 July 2018
JIACO Instruments at IPFA Conference 2018, July 17 to 19, Singapore: Booth A22: See our machine, discuss potential Speak to JIACO Instruments about how we can […]
1 May 2018
Presenting “Applications of MIP Decapsulation in Device Quality Control and Failure Analysis” in Session: Copper Wirebond Technology Panel Discussion. You can find JIACO Instruments at booth […]