Visit us on exhibition days at booth 36 We are delighted to announce that we will be joining 18th annual Device Packaging Conference (DPC 2022), held in Fountain […]
GlobalFoundries have recently published an article with a title “Methods to Enable Fault Isolation on 2.5D Molded Interposer Packages”. This publication is available in November issue […]
Visit JIACO Instruments to discuss artifact-free decapsulation Booth 818: See our machine, discuss potential collaboration Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or […]
JIACO Instruments is now a part of European research project which aims to improve the reliability of electronic components for future applications The Europe-wide research initiative […]
Our article “Enabling True Root Cause Failure Analysis Using an Atmospheric Oxygen-Only Plasma for Decapsulation of Advanced Packages” is now available in digital edition of EDFA […]
See our machine, discuss potential decapsulation solutions via the live chat function! Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements […]
JIACO Instruments at IMAPS 16th International Conference and Exhibition on Device Packaging 2020 Booth 13: See our machine, discuss potential Contact us at info@jiaco-instruments.com if you […]
Together with our customer Hirex Engineering during ISTFA 2019, Dr. Jiaqi Tang presented JIACO Instruments patent-pending Ag silver wire plasma decapsulation process. The paper entitled ‘Artifact-Free Decapsulation of […]