Presenting “Applications of MIP Decapsulation in Device Quality Control and Failure Analysis” in Session: Copper Wirebond Technology Panel Discussion. You can find JIACO Instruments at booth […]

JIACO Instruments at CAM workshop, Apr 25 & 26, Halle, Germany Presenting “Applications of MIP Decapsulation in Device Quality Control and Failure Analysis” in Session 3: Sample […]

JIACO Instruments at ISTFA conference 2017, 5-9 November, Pasadena: Booth 405: See our machine, discuss potential Session: Sample Preparation and Device Deprocessing (Nov 9, Thursday): Presenting our […]

JIACO Instruments at ESREF conference 2017, 26-27 July, Bordeaux: Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements. Discuss how to […]

JIACO Instruments at IPFA conference 2017 Booth #4: See our machine, discuss potential Session Sample Preparation, Metrology and Defect Characterization I (July 5, Wednesday): Presenting our […]

JIACO Instruments at PSECE conference 2017 Presenting “State-of-the-art Semiconductor Decapsulation Tool: MIP” at 11:30 at area 1 on Thursday 22th of Jun. Booth #23:See our machine, […]

JIACO Instruments at CAM workshop Presenting “Microwave Induced Plasma Decapsulation of System in Package Devices” at 16:20-16:40 on Wednesday 26th of April. Exhibiting at booth #10 […]

JIACO Instruments at SEMICON China 2017, 14-16 March, Shanghai Located in Hall W3, booth #3725 Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements. […]

JIACO Instruments at ISTFA conference 2016, 6-10 November, Fort Worth Booth 103: See our machine, discuss potential Session Sample Preparation and Device Deprocessing (Monday): Presenting our latest […]