GlobalFoundries have recently published an article with a title “Methods to Enable Fault Isolation on 2.5D Molded Interposer Packages”. This publication is available in November issue […]

Visit JIACO Instruments to discuss artifact-free decapsulation Booth 818: See our machine, discuss potential collaboration Contact us at info@jiaco-instruments.com if you would like to know more beforehand and/or […]

JIACO Instruments is now a part of European research project which aims to improve the reliability of electronic components for future applications The Europe-wide research initiative […]

Our article “Enabling True Root Cause Failure Analysis Using an Atmospheric Oxygen-Only Plasma for Decapsulation of Advanced Packages” is now available in digital edition of EDFA […]

See our machine, discuss potential decapsulation solutions via the live chat function! Speak to JIACO Instruments about how we can assist with your challenging decapsulation requirements […]